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Packaging firm Huhtamaki partners River Recycle and VTT to tackle floating river waste in India
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Grundfos Enters into Agreement to Acquire Leading Water Technology Company MECO
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Low CoO
Dry process in atmosphere at ambient temperature
Removes organic, inorganic and metallic films and stacks from all wafer edge surfaces
Laser precision delivers an edge exclusion zone of 25mm - 0.5mm and below with a specification accuracy of +/- 0.05mm
Small process modules can be integrated into cluster tools
About UsLow CoO
Dry process in atmosphere at ambient temperature
Removes organic, inorganic and metallic films and stacks from all wafer edge surfaces
Laser precision delivers an edge exclusion zone of 25mm - 0.5mm and below with a specification accuracy of +/- 0.05mm
Small process modules can be integrated into cluster tools
Low CoO
Dry process in atmosphere at ambient temperature
Removes organic, inorganic and metallic films and stacks from all wafer edge surfaces
Laser precision delivers an edge exclusion zone of 25mm - 0.5mm and below with a specification accuracy of +/- 0.05mm
Small process modules can be integrated into cluster tools
Services
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Low CoO
-
Dry process in atmosphere at ambient temperature
-
Removes organic, inorganic and metallic films and stacks from all wafer edge surfaces
-
Laser precision delivers an edge exclusion zone of 25mm - 0.5mm and below with a specification accuracy of +/- 0.05mm
-
Small process modules can be integrated into cluster tools
-
Low CoO
-
Dry process in atmosphere at ambient temperature
-
Removes organic, inorganic and metallic films and stacks from all wafer edge surfaces
-
Laser precision delivers an edge exclusion zone of 25mm - 0.5mm and below with a specification accuracy of +/- 0.05mm
-
Small process modules can be integrated into cluster tools
Product
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LEC-300: Laser Edge Cleaning System
Enquiry / Contact Us
U.V.Tech Systems
Mr. Salil Nair
Old No.27, (New No.24) 1st Floor, (Opp. Velvete Office), Dr. Ambedkar Road, Kodambakkam,
Chennai,Tamil Nadu,600024,India.